Packaging often represents one of the most challenging areas of manufacturing in terms of cost benefit and efficiency. But in fact, many of the solutions to packaging challenges happen at the machine level. That’s why at this year’s PACK EXPO, Oct 23-26, in Chicago, IL, you’re invited to join us in the Emerson booth #N-4736 where you can learn the exciting advances occurring at the edge in both hardware and software that can help you enhance efficiency and profitability.
At PACK EXPO, Emerson’s machine automation experts will be on hand to discuss a whole new generation of compact PLCs, ideal for meeting the needs of the growing OEM/end-user relationship and helping users with challenges like a new generation workforce and pressing supply chain issues. Learn more about new PLC technology here.
Edge solutions are on deck as the technologies to reduce packaging costs while increasing connectivity, accuracy, sustainability and productivity. Don’t miss the chance to see what’s new in edge controllers and computing. You’ll find natively integrated hardware and software packages to simplify the selection, deployment, and validation of data in solutions from small footprint edge computing to full plant analysis.
And don’t miss an amazing demonstration of augmented reality put to work in the real world today! This new, easy-to-use, affordable AR software can reduce your maintenance costs significantly right away. This new package is part of the amazing, modern “beyond SCADA” software platform that is transforming communications, visualization and security from the machine level to the enterprise. This is software you can use to solve individual problems like energy reduction and OEE measurement or to solve communications issues – all easily and affordably.
Be sure to visit the Emerson booth and see the package of automation solutions we have waiting for you.