Last week, over 40,000 packaging and processing professionals descended on Chicago for PACK EXPO. As one of the largest trade shows in North America, it’s a prime opportunity to see the latest and greatest innovations in the industry. And this year, Emerson led the charge with a range of exciting connected manufacturing solutions to help customers achieve sustainability targets and maximize production.
This year the event was held October 23- 26 and included a presentation on the Innovation Stage and a team of experts on the floor to demonstrate how having the right tools, technology and expertise can help packaging and production lines reduce waste, empower decision making, improve facility safety, sharpen the accuracy of critical measurements, increase machine availability and much more.
Vince Massey – Business Development Manager at Emerson presenting on the Innovation Stage.
In the Innovation Stage session Reduce Waste & Increase Efficiency in Clean-in Place (CIP) Process, Vince Massey presented food and beverage industry breakthroughs that help solve seven common CIP efficiency challenges. During his presentation, he shared his tips for solving these problems using proper measurement instrumentation.
To help customers make welding processes faster and more accurate, the Branson GSX-E1 Ultrasonic Welding Platform was on display. This is a new generation of welders that is more accurate and efficient. It is based on the GSX platform and is designed to weld a variety of materials, including bioplastics and nonwovens. The actuation system reduces trigger force and improves position accuracy.
Another highlight this year was the AVENTICS Series SPRA Electric Rod-Style Linear Actuator. This is a cost-effective and high-performance solution for many applications in today’s packaging lines. It offers enhanced load capacity, accuracy, and reliability that CPGs need to maximize productivity. The Series SPRA is also extremely versatile and flexible, with a choice of three different screw technologies that allow implementation within a wide range of applications.
With Movicon.NExT, you can optimize flexibility in automation software to solve problems for both CPGs and original equipment manufacturers (OEMs), from the single machine level all way up through a complete plantwide industrial internet of things project implementation.
Ajay Singh Rana – Industry Marketing Manager Food & Bev, CPG, & Life Science at Emerson demonstrating the Advanced Automation Platform Movicon.NExT
Edge computing technology helps members of the packaging and food and beverage process industries analyze and solve problems where they occur—at the machine edge. PACSystems Edge Solutions is the most advanced portfolio of edge computing and control systems, including software that simplifies problem-solving at the machine level and allows easy, cost-effective analytics and communication at the edge.
2022 Packaging & Processing Women’s Leadership Network Breakfast
This year Emerson continued the tradition of sponsoring the Packaging and Processing in Women’s Leadership Networking and Breakfast, and the Amazing Packaging Race.
The Women’s Leadership Networking breakfast was a great way to network with other women leaders, while also learning more about the industry. Keynote speaker Dawn Hudson, former Chief Marketing Officer at the National Football League and Former President and CEO of Pepsi Cola North America, on her experiences in a male-dominated workforce. She emphasized the importance of taking a personal approach, getting to know people, and being true to yourself.
Amazing Packaging Race Winners- Team two consisting of Karinne Ehni – Michigan State University, Gabby Brophy – Virginia Tech, Noah Hernandez – Virginia Tech, and Greyson Hammer – University of Wisconsin-Stout
The Amazing Packaging Race brought together 35 teams from 22 high schools and colleges across the U.S. to complete a series of challenges at exhibitor’s booths spread out across the exhibit floor. As a result of their quick-witted social media skills and show floor strategy, this year’s winners reached the most exhibitors and completed assigned tasks faster than their competitors.
The awards were presented on-site by Emerson’s executive team Hakan Erdamar, Group President, Discrete & Industrial Emerson Automation Solutions, Mark Bulanda, Executive President, Kathy Button Bell, Senior Vice President, Chief Marketing Officer, and Jenny Lenhard, President Americas & Industrial Automation.
Emerson team at PACK EXPO 2022
PACK EXPO is always an exciting event for Emerson because it provides us with a chance to showcase our latest technologies and connect with customers from around the world. In particular, this year’s show marked an important milestone for Emerson as we demonstrated our commitment to helping manufacturers maximize production, increase reliability, ensure quality and achieve sustainability in their plants.
The post Emerson at PACK EXPO 2022: The Future of Connected Manufacturing appeared first on the Emerson Automation Experts blog.